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Mid-Market CIO Panel: Tips and Techniques for Improving Vendor Relationships
July 15, 4:00 PM - 5:00 PM U.S./Eastern (GMT-4)
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Secrets of Successful Vendor Contract Negotiations for the Mid-Market
Sept. 10, 2009, 11:00 AM - 12:00 PM U.S./Eastern (GMT-4)
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July 07, 2006 — CIO —
Via Technologies has launched a new chipset it says will help reduce the size of ultra-mobile PCs by as much as 40 percent.
The company said its VX700 chipset works with its own Via C7-M microprocessors aimed at small devices.
A chipset is the pair of chips that regulate the flow of data from the microprocessor to other chips inside a device, such as memory and graphics chips.
Via slimmed down the size of its new VX700 chipset by integrating the north and south bridges of the set into a single package measuring 35 by 35 millimeters, the company said in a statement.
The chipsets will be available in mass quantities late in the third quarter, Via said. It did not disclose pricing.
The chipsets coupled with the Via C7-M microprocessor are designed to reduce power consumption and save battery life in ultra-mobile PCs, Via said. Microsoft launched the ultra-mobile PC concept earlier this year. Originally dubbed "Origami," the devices were designed to contain the power of a full PC in a gadget small enough to be carried in a pocket, purse or backpack.
DualCor Technologies, which is based in Scotts Valley, Calif., said it used the VX700 chipset and C7-M microprocessor to create a new device that adds mobile phone functionality to an ultra-mobile PC. The company did not say when the device would be launched.
More information about the Via VX700 chipset can be found online.
-Dan Nystedt, IDG News Service (Taipei Bureau)
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