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Webcast: In the Google Apps Cloud: How to Achieve Your Business Objectives
Dec 3rd, '09, 1 - 2 pm US/Eastern (GMT-5)
Join Council member Brent Hoag, Director, Global IT, at JohnsonDiversey, as he discusses the adoption of Google Apps which has helped meet four corporate goals; sustainability, simplification, increased employee productivity and global collaboration.
Webcast: Collaboration Initiatives: Benchmarks & Best Practices
Dec 15th, '09, 4 - 5 pm US/Eastern (GMT-5)
Join Council members Ruth Thorpe, VP & CIO at the U.S. Pharmaceutical Operations of Sanofi-Aventis, and Gary Kuyper, CIO at Bethany Christian Services, as they speak about their collaboration initiatives and experiences in how and why they chose the social networking and collaboration tools they are using and their business goals for collaboration, and facing culture change challenges.
Data Overview: Collaboration Initiatives Field Guide: Benchmarks & Best Practices
This appendix to the Council Field Guide provides an analysis which discusses benchmarks for collaboration IT implementation costs, adoption rates and payoffs. The overview identifies top IT and business goals and satisfaction rates for collaboration initiatives as well as best practices and lessons learned for implementing collaboration IT.
Learn more about the CIO Executive Council »July 07, 2006 — CIO —
Via Technologies has launched a new chipset it says will help reduce the size of ultra-mobile PCs by as much as 40 percent.
The company said its VX700 chipset works with its own Via C7-M microprocessors aimed at small devices.
A chipset is the pair of chips that regulate the flow of data from the microprocessor to other chips inside a device, such as memory and graphics chips.
Via slimmed down the size of its new VX700 chipset by integrating the north and south bridges of the set into a single package measuring 35 by 35 millimeters, the company said in a statement.
The chipsets will be available in mass quantities late in the third quarter, Via said. It did not disclose pricing.
The chipsets coupled with the Via C7-M microprocessor are designed to reduce power consumption and save battery life in ultra-mobile PCs, Via said. Microsoft launched the ultra-mobile PC concept earlier this year. Originally dubbed "Origami," the devices were designed to contain the power of a full PC in a gadget small enough to be carried in a pocket, purse or backpack.
DualCor Technologies, which is based in Scotts Valley, Calif., said it used the VX700 chipset and C7-M microprocessor to create a new device that adds mobile phone functionality to an ultra-mobile PC. The company did not say when the device would be launched.
More information about the Via VX700 chipset can be found online.
-Dan Nystedt, IDG News Service (Taipei Bureau)
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