Offering regional and national programs, CIO (and CSO) events bring together some of the most respected names and thought leaders in information technology and security. Presented by CIOs and other senior level executives, these invitation-only programs offer timely topics and strong networking. Learn More »
Public Council Teleconference: Application Rationalization — Hidden Costs and Smart Decisions
November 17 at 11:00 am US/Eastern (GMT-5)
Join Honorio Padrón, of The Hackett Group, who will share the drivers for companies to tackle application rationalization and the results of research that define the hidden cost of complexity. Additionally, we will discuss key decision milestones—to start or not, holding the course steady and fulfilling expectations.
Virtual Desktop Cost-Benefit Analysis — Michael Jacobs, Catlin Group
The analysis contained in this presentation measures the cost of everything from the machines and licenses to the infrastructure for virtual vs. traditional desktop environments.
Honor your best senior team members - Apply for the CIO Ones to Watch Award
Get well-earned public recognition for your top up-and-coming team members, your IT organization and your enterprise. Award winners will be announced, publicized and feted in May 2010, great timing to help attract new IT recruits to your company.
Learn more about the CIO Executive Council »March 01, 2003 — CIO —
You won’t Be able to use your laptop as a portable coffee warmer anymore, if technology from Sandia National Laboratories goes mainstream.
The lab has created a technique that could replace the standard, functional, but not terribly efficient, metal heat sinks currently used to extract damaging warmth from computer chips. While the sinks do their job of protecting the computer, much of the heat ends up dispersed into the local surroundings?most likely the users desk, or worse, their lap. And those small fans whirring away inside laptop housings just don’t do much to boost the comfort level.
The Sandia technology uses small (less than hair-thickness) copper "wicks" to transport methanol?and waste heat?from one area of a computer to another, where it can be dispersed more efficiently, comfortably and compactly than with heat sinks. According to Sandia, the technique has another advantage as well?it will allow for even hotter chips, meaning faster processors and more dense designs. Of interest to the military (to whom small moving parts are a potentially life-threatening annoyance), the system can even work without a fan, dispersing the piped heat instead through cooling fins as the methanol condenses from hot vapor to cool liquid and begins its return trip to the processor.
Making use of the technology will require minimal design work on the part of computer makers, according to the lab. Sandia has intentionally created the system to fit inside the existing form factor already in use by standard heat-sink cooling. In the future, however, the web of hair-thick pipes could be directed in any direction the manufacturer deems most appropriate.
As of this writing, Sandia was in the process of licensing the technology to a startup company that plans to market products to the consumer laptop space. No release date has been announced, but when it comes, we may all be a little cooler.