Via Technologies will introduce a chip later this year that combines most of a computer’s components in a single package, the company’s chief executive said Wednesday.Called John, the upcoming chip combines Via’s C7 processor, chipset, and a graphics processor in a single package, said Wenchi Chen, Via’s president and chief executive officer. Chen held up a sample of John during his keynote presentation at the Via Technology Forum, which is being held alongside the Computex exhibition in Taipei.John will be produced in volume later this year, he said.Chen has long championed a push toward smaller computers that consume less power. While Intel executives touted the power-hungry Pentium 4 with its massive cooling systems, Chen instead pushed smaller PCs built around Via’s Mini-ITX motherboard and fanless processors. Now, the focus on smaller, more energy-efficient computers has become an industry-wide trend. The introduction of John takes the notion that “small is beautiful” one step further, Chen said. “This is the direction where we’re going to push going forward,” Chen said.To underscore his point, Chen pulled a small motherboard from his pocket. The board, which easily fits into his hand, included a John chip and the dynamic RAM required for a computer. The board is designed to be used in handheld computing applications, he said. Computex runs through June 10.-Sumner Lemon, IDG News ServiceFor related news coverage, read Via Goes ‘Pret-a-Porter’ With Vogue PCs.Check out our CIO News Alerts and Tech Informer pages for more updated news coverage. Related content BrandPost Smart UPS Connectivity: what it is and why you need it By Veronica Lew Mar 27, 2023 4 mins Remote Access Opinion Huawei’s F5G rollout plan signals new wave of green technology and digital transformation At MWC, Gu Yunbo, President of Huawei’s Enterprise Optical Business Domain, sat down with CIO to discuss a raft of new F5G launches, and what they mean for enterprise computing. By Peter Kirwan Mar 27, 2023 4 mins Digital Transformation Opinion Huawei launches intelligent data storage solutions at MWC to satisfy rising multi-cloud demand Peter Zhou, President of Huawei’s IT Product Line, joined CIO at Mobile World Congress in Barcelona to discuss a rising tide of enterprise investment in storage solutions for on-premises data centers and private clouds. By Peter Kirwan Mar 27, 2023 4 mins Data Management BrandPost AI bots for customer experience: trends, insights, and examples How can you implement AI bots in your company, and what will they be able to do for you? Here’s how Avaya expects things to shake out. By Mike Kuch, Sr. Director Solutions Marketing, Avaya Mar 27, 2023 5 mins Artificial Intelligence Podcasts Videos Resources Events SUBSCRIBE TO OUR NEWSLETTER From our editors straight to your inbox Get started by entering your email address below. Please enter a valid email address Subscribe