In response to demand for ever-smaller cell phones, STMicroelectronics announced the availability of a new type of memory chip packaging technology on Wednesday.
Package-on-Package technology allows certain components to be assembled in a vertical stack, offering space savings to mobile phone makers. The technology is particularly helpful in the construction of high-end mobile phones with high-density memory and complex processor combinations, STMicroelectronics said.
Package-on-Package technology also offers manufacturers flexibility in how they combine components and design their products.
By employing the technology, manufacturers can also source and test the memory system and logic device separately. The technique can simplify assembly on multimedia mobile phones.
A variety of components can employ the Package-on-Package configuration, including NOR Flash and NAND Flash.
The Joint Electron Device Engineering Council, the standard-setting body for the semiconductor industry, is working on defining a specification for the technology, STMicroelectronics said.
Mobile phones support a growing array of functions including video recorders and players, cameras and music downloads. These capabilities demand increasing memory and processing power, requiring larger components that often boost the size of devices. Mobile phone makers are keen to employ technologies that can help keep the final products small.
-Nancy Gohring, IDG News Service (Dublin Bureau)
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