Micron Technology is offering a new 16GB DRAM memory chip it’s billing as the densest server-memory module on the market.
Micron Technology in Boise, Idaho, said its new memory module features 72 2-gigabit double data rate 2 (DDR2) dies that are packaged as 36 4-gigabit TwinDie components.
Micron said its proprietary TwinDie stacking technology offers fewer and shorter connection routes to the chips, which enable faster access to data in the memory. The retention, reliability and availability of data in computer memory concern enterprises that process large amounts of data, such as banks or shopping websites.
The 16GB module offers twice the capacity of memory modules available today, said Kevin Kilbuck, senior manager of strategic marketing and product development for Micron. “We are ahead of the pack in terms of density,” he said.
Micron’s move is seen as an aggressive market play by Shane Rau, a chip industry analyst at IDC.
“It is in keeping with how server makers are keeping up with demand for memory,” Rau said. The forecast for the average amount of memory capacity in midrange servers shipped by the end of 2006 is 38GB, up 60 percent from an average 24GB in 2005, he said, citing IDC research.
While Micron’s new module is the densest in the industry to date, Rau anticipated that “it will be closely followed by other competitors.”
Micron’s rivals in the memory module market include Munich-based Qimonda, Hynix Semiconductor of South Korea, and Samsung Electronics of Japan.
Micron sells to server manufacturers. Some of Micron’s customers are evaluating samples of the 16GB memory modules, and commercial availability of the product is slated for later this year, the company said.
-Robert Mullins, IDG News Service (San Francisco Bureau)
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